- Automated Production: Full-process automation from PCB loading to finished goods, using automatic chip mounters, printers and reflow ovens.
- Intelligent Control: Real-time monitoring and process optimization via MES & IoT.
- AI & Machine Learning: AI-driven defect detection, predictive maintenance and process optimization.

- Placement Accuracy: Advanced mounters (Siemens SX series) achieve ±25μm accuracy, supporting 01005 and smaller components.
- High Speed: Multi-gantry mounters exceed 200,000 CPH. Dual-track lines double efficiency.
- Fine-Pitch Capability: Supports QFN, BGA, CSP for high-density PCBs in 5G and automotive electronics.

- Quick Changeover: Intelligent programming & modular design reduce changeover time within 10 mins, ideal for multi-variety, small-batch production.
- Compatibility: Supports PCBs from 50×50mm to 510×460mm for LED, consumer electronics & medical applications.

- In-line Inspection: AOI, AXI & flying probe testing ensure real-time defect rejection, with FPY over 99%.
- Environment Control: Constant temperature & humidity, ESD protection safeguard precision components.

Selective soldering: Local soldering for THT & SMT+THT PCBs, avoiding thermal shock to sensitive components.
- High precision: Multi-nozzle design, 2 mm minimum pitch, ±50 μm accuracy via laser/visual positioning.
- Intelligent & reliable: Independent temperature control (up to 300℃), nitrogen atmosphere for 20%+ better wettability.
- Flexible production: Changeover＜5 min, supports 50×50 to 500×450 mm PCBs and odd-shaped components.
- In-line traceability: Integrated AOI/3D inspection, MES-based full-process parameter recording.

Pin insertion for THT components: pin headers, terminals, relays, etc.
- High Precision & Speed: Servo + vision positioning, ±0.05mm accuracy, 0.5mm pitch, >10,000 pins/hour.
- Smart Error Prevention: Force feedback avoids bending/missing pins, defect rate ＜0.1%. AI optimizes insertion sequence.
- Flexible & Quick Change: Modular fixtures, changeover ＜3 mins. Supports THT and Press-fit.

Conformal coating for PCBs to enhance moisture, corrosion and dust resistance.
- High Precision Selective Spraying: Non-contact spraying, 10-50μm (±5μm) thickness, vision positioning to avoid no-spray areas.
- Smart Process Control: Auto-adjust pressure/flow for various coatings. UV/hot air curing ＜30s.
- Environmental & Safe: Closed spraying + VOC treatment, RoHS/REACH compliant. Coating utilization >90%.
- In-line Inspection & Traceability: IR/3D inspection, MES records parameters for quality traceability.

Collaborative robots / 6-axis arms for precision assembly.

Servo + vision, torque accuracy ±1%, prevents missing/loose screws.

High-precision jet dispensing with ±0.02mm tolerance.

- Robot Automatic Loading & Unloading: Robotic arms (e.g., EPSON SCARA robots) feed products to be tested into test stations, minimizing manual intervention.
- Parallel Testing: Multi-station simultaneous testing (e.g., 4 mobile phones undergoing 5G RF calibration at the same time), improving efficiency by 300%.
- AI Visual Inspection: Deep learning algorithms identify appearance defects (scratches, color differences) with an accuracy of >99.9% (e.g., Cognex ViDi).

- Real-time monitoring and early warning: SPC (Statistical Process Control) analyzes test data and automatically triggers alarms (e.g., out-of-tolerance parameters).
- Predictive maintenance: Predict test equipment failures through data such as vibration and temperature to reduce downtime.

- Modular test architecture: Supports quick change of test fixtures (e.g., shared test platform for mobile phones, TWS earbuds and smart watches).
- OTA (Over-the-Air) test: Automated RF testing for 5G / Wi-Fi 6E / Bluetooth (e.g., Keysight UXM5G tester).